| About |
|---|
| EPO-TEK® E3001 is a one component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications using a snap-cure profile.&& |
| Product Description | |
|---|---|
| Generic | 环氧树脂 |
| Material Status | Commercial: Active |
| Features | Conductive |
| Availabilitys | Africa & Middle East ,North America,Asia Pacific,Europe |
| Technical Data | |||
|---|---|---|---|
| PHYSICAL | Nominal value | Unit | Test method |
| Particle size | < 45.0 | µm | |
| Supplementary information | Nominal value | Unit | Test method |
|---|---|---|---|
| Degradation Temperature | 428 | ℃ | TGA |
| Die Shear Strength（>5 kg，23℃） | 11.7 | MPa | |
| working temperature | |||
| Continuous | -55 to 200 | ℃ | |
| Intermittent | -55 to 300 | ℃ | |
| Storage Modulus（23℃） | 2.59 | GPa | |
| Thixotropic index | 2.70 | ||
| Heating reduction | |||
| 200℃ | 0.040 | % | |
| 300℃ | 0.22 | % |
| Uncured Properties | Nominal value | Unit | Test method |
|---|---|---|---|
| colour | Silver | ||
| Density | 2.75 | g/cm³ | |
| viscosity | |||
| 23℃ | 2.0 to 4.1 | Pa·s | |
| Curing time | |||
| 150℃ | 1.0 | hr | |
| storage stability | 1400 | min |
| Cured Properties | Nominal value | Unit | Test method |
|---|---|---|---|
| Shore hardness | |||
| Shaw’s D | 78 | ||
| lap shear strength | |||
| 23℃ | 9.59 | MPa | |
| Volume resistivity | |||
| 23℃ | < 5.0E-4 | ohms·cm | |
| 23℃ | 7.0E-4 | ohms·cm |
| THERMAL | Nominal value | Unit | Test method |
|---|---|---|---|
| — | 5.0E-5 | cm/cm/℃ | |
| — | 1.2E-4 | cm/cm/℃ | |
| Glass transition temperature | > 90.0 | ℃ | |
| Linear coefficient of thermal expansion | |||
| MD | |||
| Thermal conductivity coefficient | 0.93 | W/m/K | |
| Storage period | |||
| -40℃ | 52 | wk |
| Notes |
|---|
| 1. Typical properties: these are not to be construed as specifications. |
| 2. Dynamic Cure 20-200°C/ISO 25 Min; Ramp -10-200°C @ 20°C/Min |
| 3. Below Tg |
| 4. Above Tg |
| 5. 100 rpm |
| 6. 200°C/2 min cure |
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