About Acculam® Epoxyglas G11 nonFR -Laminate sheet comprised of heat resistant/halogen free epoxy resin and a woven fiberglass substrate. It qualifies to NEMA G11 and MIL-I-24768/3 This material exhibits extremely high mechanical strength at elevated temperatures and has good dielectric…
About Accura® e-Stone™ material is compatible with all intraoral and impression scanning systems that output an .stl file to produce accurate, durable models of individual teeth and arches with crisp resolution. Normal dental lab practices, including drilling, grinding and waxing,…
About EPO-TEK® OG142-112 is a single component, low viscosity epoxy for adhesive sealing and encapsulating fiber optic and opto-electronic packaging applications.&& Product Description Generic 环氧树脂 Material Status Commercial: Active Features Low Viscosity,UV Cure,Good bond Availabilitys Africa & Middle East ,North…
About GM 978/D is a modified 2-components epoxy resin system, which cures at room temperature. In cured state the mechanical properties and strengths of moulded parts are like those of injection moulded parts. For this reason inspection samples and experimental…
About A single component, high Tg, thermally conductive, semiconductor die-attach grade epoxy. It was designed for bonding chips and SMD’s inside hybrid micro-electronic packages. Other applications include JEDEC and opto-electronic packaging.&& Product Description Generic 环氧树脂 Material Status Commercial: Active Features…
About LOCTITE HYSOL KL 1000-3LX provides the lowest cost of ownership with superior moldability and reliability. This material is designed to achieve JEDEC Level 4 requirements, at 220°C reflow temperature.&& Product Description Supplier Henkel Generic 环氧树脂 Material Status Commercial: Active…
About Epiall 1908B-1 is a short fiberglass reinforced epoxy molding compound, with excellent dimensional stability, good strength properties and good electrical insulation properties.&& Product Description Supplier SBHPP Generic 环氧树脂 Material Status Commercial: Active Features Good Rigidity,Good Dimensional Stability,Insulation,V-0 Availabilitys North…
About Naphthalene Epoxy Biphenyl Naphthalene Epoxy&& Product Description Generic 环氧树脂 Material Status Commercial: Active Availabilitys Asia Pacific Technical Data optical performance Nominal value Unit Test method Refractive index 1.6000 to 1.7000 Supplementary information Nominal value Unit Test method Epoxy…
About 20-3035 is a low density, two component epoxy potting and encapsulating system. The 20-3035 is less than half the weight of most commercially available potting compounds. 20-3035 exhibits very low shrinkage during the cure cycle and also has a…
About 20-3004 LV & HV are two component chemical resistance epoxy systems. They were developed for potting, coating, and adhesive applications requiring superior chemical resistance. They exhibit outstanding bonds to a variety of substrates. 20-3004 LV is a low viscosity…
About STYCAST 2017M4 is an epoxy encapsulant developed for blue Light Emitting Diodes.&& Product Description Supplier Henkel Generic 环氧树脂 Material Status Commercial: Active Features Baking Availabilitys Africa & Middle East ,North America,Latin America,Asia Pacific,Europe Technical Data PHYSICAL Nominal value Unit…
About A two component, high temperature grade, thermally and electrically insulating epoxy, designed for adhesive and sealing applications found in semiconductor, electro-optics, fiber optics, medical, and scientific/OEM industries. It is a low viscosity, optical grade epoxy with low index of…
About DESCRIPTION Cosmic E4920D is a mineral filled epoxy molding compound which is available either in a granular form, or preformed in a variety of sizes and weights. FEATURES It has excellent moisture resistance, thermal cycling stability and outstanding moldability.…
About This material is an epoxy molding compound optimized specifically for PBGA applications with no plasma cleaning required before molding. It has the same unique resin system as the SMT-B-1, which minimizes warpage and enables trouble-free molding onto rigid and…
About DESCRIPTION: Epocast® 1617-A/B epoxy syntactic is a low-density, self-extinguishing compound for edge sealing honeycomb structures. The lightweight epoxy is an easy-to-handle material that exhibits high strength after curing. Epocast® 1617-A/B epoxy syntactic cures to an off-white color and is…
About CYCOM® 934 is a high flow, 350°F (177°C) curing epoxy resin with good 200°F (93°C) wet and 350°F (177°C) dry service capability. CYCOM 934 is formulated for autoclave processing, but it has been successfully processed by press molding. Unidirectional…
About Thermoset Plastics EP-521 is an Epoxy; Epoxide (Epoxy) material filled with filler. It is available in North America for casting or encapsulating. Important attributes of Thermoset Plastics EP-521 are: Insulating Rigid Wear Resistant Typical application of Thermoset Plastics EP-521:…
About NEONIT® SK80 L8G is a long glass fiber reinforced epoxy molding compound with excellent long term property retention over a wide temperature range and climate conditions. It is particularly suited for over molding and manufacturing of large commutators.&& Product…
About E 8354A-1 is a fiberglass and mineral reinforced epoxy molding compound, with excellent dimensional stability, good electrical insulation properties, and good strength.&& Product Description Supplier SBHPP Generic 环氧树脂 Material Status Commercial: Active Features Good Rigidity,Good Dimensional Stability,Insulation,V-0 Availabilitys North…
About 49N is a low-flow epoxy prepreg engineered for bonding multilayer epoxy rigid-flex or attaching heatsinks to multilayer epoxy PCBs. With a high Tg, the prepreg can be used in high-performance or hightemperature applications compared to a standard difunctional epoxy…