About EPO-TEK® T7110 is a two component, thermally conductive, electrically insulating epoxy designed for heat sinking electronics and semiconductors. It may be used as an adhesive, potting, or encapsulation material, for industries such as consumer, medical or optics.&& Product Description…
About DESCRIPTION: Epocast® 89537-A/B epoxy syntactic is a two-part system with glass-fiber reinforcement that can be trowelled or extruded into honeycomb core structures for fastener and attachment potting, core splicing and edge reinforcing. The syntactic has a non-sag consistency that…
About A single component, UV curable, thixotropic flexible epoxy adhesive/encapsulant designed for semiconductor and opto-electronic packaging. Glob top over IC and wire bonds, and low stress bonding of fiber optic components, are common applications. It is a replacement for EPO-TEK®…
About EASYPOXY K-20 is a general purpose, two-component, room-temperature curing adhesive/sealant that bonds a wide variety of surfaces. EASYPOXY K-20 is relatively insensitive to mixing ratios. Since there are no solvents, there is no fire hazard. EASYPOXY K-20 is non-toxic…
About CMET TSR-880 is an Epoxy; Epoxide (Epoxy) material. It is available in Asia Pacific or North America for 3d printing, stereolithography.&& Product Description Generic 环氧树脂 Material Status Commercial: Active Availabilitys North America,Asia Pacific Technical Data PHYSICAL Nominal value Unit…
About ebalta AH 140 is a very thin liquid two-component-epoxy resin with high values of strength and high heat resistance. Due to its very good impregnating and wetting properties it is suitable as laminating resin for high-strength components with fabrics…
About W2-3 made by ECUST is a kind of Novolac epoxy vinyl ester resin. It has excellent anticorrosion and high temperature resistance, also has excellent qualities. PROPERTY High heat-resistance, heat distortion temperature for casting is 145°C and for FRP is…
About GR869 is a green semiconductor grade molding compound especially designed for SOIC, TSOP and QFP packages with Ni/Pd and copper leadframes. It offers much improved JEDEC performance as well as moldability property. GR869 meets UL 94 V-0 Flammability at…
About OPTODYNE™ UV-2100 Optodyne UV-2100 is a single component, epoxy-based UV curable adhesive designed for bonding optical connectors, lenses, prisms and other optical components. Its exceptional strength, combined with its unique index matching capability, make the Optodyne Series of…
About EPO-TEK® 301-2FL is a two component optical, medical, and semiconductor grade epoxy resin. It is a more flexible version of EPO-TEK® 301-2.&& Product Description Generic 环氧树脂 Material Status Commercial: Active Features High impact resistance,Biocompatible,Good bond,Nontoxicity Availabilitys Africa & Middle…
About EPO-TEK® CF6-2 is a two component, high temperature and high Tg epoxy designed for fiber optic packaging.&& Product Description Generic 环氧树脂 Material Status Commercial: Active Features Low Viscosity,High pressure disinfection,High Heat Resistance,Low odor,Radiation disinfection,Ethylene oxide disinfection Availabilitys Africa &…
About EASYPOXY K-22 is a general purpose, two-component, room-temperature curing adhesive/sealant that bonds a wide variety of surfaces. EASYPOXY K-22 is relatively insensitive to mixing ratios. Since there are no solvents, there is no fire hazard. EASYPOXY K-22 is non-toxic…
About Crystalline Epoxy&& Product Description Generic 环氧树脂 Material Status Commercial: Active Features Crystal Availabilitys Asia Pacific Technical Data Supplementary information Nominal value Unit Test method Epoxy equivalent 170 to 200 g/eq Notes 1. Typical properties: these are not to be…
About 20-3236 Resin is a low viscosity copolymer adhesive and potting compound specifically designed for bonding vinyls and neoprenes. 20-3236 Resin has an extended working time and a convenient 2:1 mix ratio. 20-3236 Resin can be used in many difficult…
About ebalta GH 730/BR is a quite versatile two-components epoxy resin with good castability, curing at room temperature. Due to its easy workability as well as its high strength and low shrinkage there’s a big variety of applications as mouldmaking,…
About A two component, room temperature-curing, thermally and electrically insulating epoxy. It can be used for adhesive, sealing, potting or encapsulation applications found in semiconductor, electronics, optical and medical devices.&& Product Description Generic 环氧树脂 Material Status Commercial: Active Features Thermal…
About Ad-Tech Epoxy ESR-212 is an Epoxy; Epoxide (Epoxy) product filled with iron. It can be processed by coating and is available in North America. Applications of Ad-Tech Epoxy ESR-212 include coating applications, repairing material and tools. Primary characteristic: good…
About DAPCO™ 3004 is a two-component, high strength, structural epoxy adhesive which cures at normal room temperature. Features & Benefits: Thixotropic flow properties permit use on vertical or overhead areas Bonds a variety of substrates, including metal, wood, concrete and…
About Nordbak Cold Cure Backing是一种环氧; 环氧树脂产品,。 它,在北美洲有供货。 主要特性为:flame retardant。&& Product Description Supplier Henkel Generic 环氧树脂 Material Status Commercial: Active Features Flame Characteristics,Good stability Availabilitys North America Technical Data MECHANICAL Nominal value Unit Test method Shore hardness Shaw’s D 90 …
About Single component, UV curable epoxy for adhesive sealing and encapsulating applications found in semicondutor, electro-optics, fiber optics, medical and scientific/OEM industries. Replacement for EPO-TEK® OG154. Formerly 90-108-5&& Product Description Generic 环氧树脂 Material Status Commercial: Active Features UV Cure Availabilitys…