About Standard product Electrics&& Product Description Supplier Adeka Generic 环氧树脂 Material Status Commercial: Active Availabilitys Africa & Middle East ,North America,Latin America,Asia Pacific,Europe Technical Data PHYSICAL Nominal value Unit Test method Density 1.16 g/cm³ Chlorine Content（Saponifable） 0.1 wt% colour G，Max…
About CYCOM® 890 RTM is a one-part liquid epoxy resin system. It has one month out-life at room temperature which reduces the time required for the freeze-thaw-storage processes in a production environment. Its frozen storage shelf-life is 12 months at…
About WEVOPOX 2501 FL/WEVODUR CC 5001 is an Epoxy; Epoxide (Epoxy) material. It is available in Europe or North America. Important attributes of WEVOPOX 2501 FL/WEVODUR CC 5001 are: Flame Rated RoHS Compliant&& Product Description Supplier WEVO Generic 环氧树脂 Material…
About A two component, electrically and thermally insulating epoxy adhesive designed for semiconductor, electronics, medical, and optical applications. It is an IR transparent version of EPO-TEK H74 which enables fiber optic and photonic packaging. Due to its low viscosity, it…
About LOCTITE STYCAST EO 7038 is a one component epoxy potting system, formulated to protect sensors used in harsh environments, such as automotive applications.&& Product Description Supplier Henkel Generic 环氧树脂 Material Status Commercial: Active Features Baking Availabilitys Africa & Middle…
About LTM® prepregs are proprietary low temperature cure, epoxide based resin systems that may be post-cured to produce high temperature composite tools. LTM13 compliments the LTM10 series by offering a cost effective mould tooling system with a low temperature, 30°C…
About A single component, silver-filled and electrically conductive adhesive designed for semiconductor die attach and bonding SMDs for hybrid microelectronic packaging. It is certified and lot accepted to the requirements of MIL-STD 883/Test Method 5011. It can be used for…
About EPO-TEK® TD1001 is a single component, thermally conductive, electrically insulating epoxy designed for low stress semiconductor and electronics packaging.&& Product Description Generic 环氧树脂 Material Status Commercial: Active Features Thixotropic,Good bond,Thermal conductivity,Insulation Availabilitys Africa & Middle East ,North America,Asia Pacific,Europe…
About Developed for Power Device Package that needs Good Heat Dissipation Through Molding Compound. Strong Points High Thermal Conductivity with Good Moldability, Excellent Moisture Resistance and Low Stress. Used in Auto Molding System by Rapid Cure Grades. KE-870 and KE-880…
About Thermoset Plastics 302 is an Epoxy; Epoxide (Epoxy) material. It is available in North America for casting or encapsulating. Important attributes of Thermoset Plastics 302 are: Heat Resistant Insulating Low Viscosity Typical application of Thermoset Plastics 302: Wire &…
About This material is a reduced-stress epoxy molding compound for the enapsulation of a variety of semiconductor devices ranging from small lead count DIPs to medium lead count PLCCs, QFPs and SOICs. It was especially developed for balanced end use…
About BR® 623-1 potting compound is a one-part epoxy material designed for use in insert or edge filling of honeycomb structure. It has been formulated to have low viscosity making it especially suitable for hand- filling small cell size honeycomb.…
About HYSOL® US1750™ elastomeric polyurethane, is a water-white, clear, medical grade, fast gel potting material. It is ideal for blood heat exchanger, dialyzer and oxygenerator units.&& Product Description Supplier Henkel Generic 环氧树脂 Material Status Commercial: Active Features Rapid solidification poin,Room…
About Magnobond 3347 is an Epoxy; Epoxide (Epoxy) product. It is available in North America. Typical application: Electrical/Electronic Applications. Primary characteristic: low viscosity.&& Product Description Generic 环氧树脂 Material Status Commercial: Active Features Good Electrical Properties,Low Viscosity Availabilitys North America Technical…
About EPO-TEK® H21D is a two component, high Tg, silver-filled epoxy designed for chip bonding in microelectronic and optoelectronic applications.&& Product Description Generic 环氧树脂 Material Status Commercial: Active Features Conductive,Low odor Availabilitys Africa & Middle East ,North America,Asia Pacific,Europe Technical…
About Halogen-Free FR Epoxy (Phosphorus-modified Epoxy) Features: Novolac + DOPO Base&& Product Description Generic 环氧树脂 Material Status Commercial: Active Features Halogen free,Flame Characteristics Availabilitys Asia Pacific Technical Data PHYSICAL Nominal value Unit Test method viscosity 25℃ < 1.00 Pa·s Supplementary…
About EPO TEK® 353ND-T is a two component, highly thixotropic epoxy with non-flowing properties and high temperature resistance.&& Product Description Generic 环氧树脂 Material Status Commercial: Active Features Thixotropic,High Heat Resistance Availabilitys Africa & Middle East ,North America,Asia Pacific,Europe Technical Data…
About LOCTITE HYSOL GR 2320 epoxy molding compound delivers outstanding performance and ease of use.&& Product Description Supplier Henkel Generic 环氧树脂 Material Status Commercial: Active Features Excellent Processability,Low (to None) Ion Content,Quick molding cycle,Baking,Laser engraving,Low moisture absorption Availabilitys Africa &…
About Thermoset Plastics 321 is an Epoxy; Epoxide (Epoxy) material. It is available in North America for casting or encapsulating. Important attributes of Thermoset Plastics 321 are: Insulating Rigid Typical application of Thermoset Plastics 321: Wire & Cable&& Product Description…
About FP4654 encapsulant is designed for larger cavity-fill or dam-and-fill applications.&& Product Description Supplier Henkel Generic 环氧树脂 Material Status Commercial: Active Features High purity,Baking,Solvent resistance,Heat Stabilized Availabilitys Africa & Middle East ,North America,Latin America,Asia Pacific,Europe Technical Data MECHANICAL Nominal value…