About 70-3812 NC is a two component, aluminum filled epoxy system. This system is used for making heat resistant tools, parts, or bonds that require the highest thermal conductivity and heat resistance. We have developed this extremely conductive epoxy by…
About EPO-TEK® 301-2 is a two component optical, medical, and semiconductor grade epoxy resin, with low viscosity, long pot-life, and good handling characteristics.&& Product Description Generic 环氧树脂 Material Status Commercial: Active Features High impact resistance,Low Viscosity,Biocompatible,Low odor,Good bond,Nontoxicity Availabilitys Africa…
About CYCOM® 2040 is a very tough modified epoxy resin system with exceptional high temperature performance. It is suitable for highly stressed components exposed to elevated temperature environments (under bonnet/engine bay) including impact/crash structures. A two hour cure at 180°C…
About A two component, optically opaque epoxy adhesive designed for semiconductor and PCB applications in optoelectronic instrumentation and assemblies. A lower viscosity version of EPO-TEK® 320 that can be poured, potted or cast into shape.&& Product Description Generic 环氧树脂 Material…
About EPO-TEK® H77 is a two component, thermally conductive, electrically insulating epoxy system designed for lid-sealing of hybrids found in hermetic packaging of micro-electronics. Lids can be ceramic, glass, aluminum or kovar. Package types can be plastic, metal cases or…
About LOCTITE HYSOL GR 725LV is a semiconductor grade molding compound designed for power package applications. This material is designed to achieve high JEDEC MSL requirements, at 260°C reflow temperature.&& Product Description Supplier Henkel Generic 环氧树脂 Material Status Commercial: Active…
About EPO-TEK® H65-175MP is a single component, alumina-filled epoxy for military hybrid die and component attach. It can also be used for semiconductor and high temperature ceramic and vacuum packaging.&& Product Description Generic 环氧树脂 Material Status Commercial: Active Features Low…
About EPO-TEK® H20E-LV is a two component, 100% solids silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is a low viscosity version of EPO-TEK® H20E, semiconductor die-attach epoxy.&& Product Description Generic 环氧树脂 Material Status…
About A two component, black-colored and optically opaque epoxy designed for optical, medical, and opto-electronic packaging of semiconductor devices and components. It is a modification of EPO-TEK ® 320 for increased insulation and dielectric properties.&& Product Description Generic 环氧树脂 Material…
About EpoxAcast® 690 is a UV resistant clear casting epoxy that is ideal for making clear jewelry/beads or replacement lenses for kit cars and other applications requiring a rigid, clear finished product. EpoxAcast® 690 can be colored with SO-Strong® color…
About High RI Epoxy High Tg&& Product Description Generic 环氧树脂 Material Status Commercial: Active Availabilitys Asia Pacific Technical Data PHYSICAL Nominal value Unit Test method colour < 3.0 G optical performance Nominal value Unit Test method Refractive index 1.6000 to…
About Ad-Tech Epoxy EC-428 is an Epoxy; Epoxide (Epoxy) product filled with aluminum. It can be processed by casting and is available in North America. Typical application: Tools.&& Product Description Generic 环氧树脂 Material Status Commercial: Active Features Low Exotherm,Machinable Availabilitys…
About A heavy-duty, premium floor patching system (includes primer) Intended Use: Used to repair concrete in chemical environments where heavy concentrations of acids, alkalais, and hydrocarbons are destroying the floor. Ideal for rebuilding floors around acid dip tanks, pump pads,…
About LOCTITE HYSOL GR 2720 is a green epoxy based molding compound designed for the encapsulation of passive components. This material is an excellent candidate for the molding of pressure sensitive components. LOCTITE HYSOL GR 2720 meets UL 94 V-0…
About Lytex 9063 is a high performance, glass fiber reinforced epoxy sheet molding compound designed for military and aerospace structural applications requiring excellent mechanical properties, retention of properties at elevated temperatures, good chemical resistance and excellent electrical properties. It meets…
About CYCOM® E773/E773FR resins are controlled flow epoxy systems with a large processing window. They exhibit excellent high temperature performance up to 180°F (82°C) wet service temperature. The systems have good retention of tack and drape up to 20 days…
About A two component epoxy with intermediate viscosity range between EPO-TEK® 353ND and EPO-TEK® 353ND-T. It is designed for semiconductor glob top applications, as well as use in medical and fiber optic industries.&& Product Description Generic 环氧树脂 Material Status Commercial:…
About Product Description Epoxy moulding compound, inorganically filled, glass fibre reinforced, heat resistant, dimensionally stable, good electric and mechanical properties, very good chemical resistance, low viscosity, UL listed (RTI 155°C) Application Areas Encapsulation of electric parts, e.g. electromagnetic coil&& Product…
About EPO-TEK® OG198-55 is a high viscosity, single component, electrically and thermally insulating, clear UV cure epoxy. It is the more thixotropic version of EPO-TEK® OG198-54.&& Product Description Generic 环氧树脂 Material Status Commercial: Active Features Thermal insulation,High Viscosity,Thixotropic,UV Cure,Insulation Availabilitys…
About STYCAST 3050 Catalyst 9 is designed for potting and encapsulation applications with very small physical spacing between parts. The filler system is non-abrasive and readily machinable. This is a consideration when using a dispensing equipment or where subsequent machining…