About SBNA INSUL-PLATE™ Hole-Fill material delivers true reliability and superior performance. This material, in powder form, is specifically suited for Hole-Fill use in glass epoxy, multi-layer and polyimide metal core circuit boards. The material is designed to meet or exceed…
About Acculam® Epoxyglas G11/ FR5 -Laminate sheet comprised of flame retardant/heat resistant epoxy resin and a woven fiberglass substrate. It qualifies to NEMA FR5 and MIL-I-24678 This material exhibits extremely high mechanical strength at elevated temperatures. It shows good dielectric…
About Surperior mechanical properties and chemical resistance at elevated temperature. High heat distortion temperature with excellent fatique resistance. – Suitable for more aggressive corrossive applications. Various fabrication process like hand layup, filament winding, pultrusion etc. Can comply with US FDA…
About High Purity Epoxy Features: Low T-Cl Content, Less-Crylstalline&& Product Description Generic 环氧树脂 Material Status Commercial: Active Features High purity Availabilitys Asia Pacific Technical Data PHYSICAL Nominal value Unit Test method viscosity 25℃ 10.0 to 20.0 Pa·s 25℃ 10.0 to…
About LOCTITE STYCAST 2651MM CAT 23LV is a general purpose encapsulant designed for machine dispensing and for parts requiring post molding machining. LOCTITE STYCAST 2651MM CAT 23LV can be used with a variety of catalysts. For more information on mixed…
About EPO-TEK® 302-3M is a two component epoxy used for optical, medical, fiber optic, and semiconductor applications. The epoxy is good for adhesive joining, sealing, potting, or as a coating.&& Product Description Generic 环氧树脂 Material Status Commercial: Active Features Low…
About Two Component Epoxy Epic S7513 is a thermally conductive potting and casting compound that possesses a low CTE. its low mixed viscosity allows it to reach intricate areas on electronics applications.&& Product Description Generic 环氧树脂 Material Status Commercial: Active…
About LOCTITE HYSOL GR 15F-1P is an anhydride cured molding compound containing spherical filler designed for those applications requiring high voltage, high power and/or high temperature performance.&& Product Description Supplier Henkel Generic 环氧树脂 Material Status Commercial: Active Features High Heat…
About This material is a state-of-the-art, low stress epoxy encapsulant designed for packaging stress-sensitive semiconductor devices. It offers end users superior value-in-use due to a balanced mix of properties.&& Product Description Generic 环氧树脂 Material Status Commercial: Active Features Excellent Processability,Good…
About CYCOM® 823 RTM is a liquid epoxy resin system. It is primarily available as a one-part system, with one working week out-life at room temperature so as to remove the requirement for customers to carry out resin mixing and…
About ABLEBOND® 789-3™ die attach adhesive is designed for microelectronic applications. This adhesive exhibits strong adhesion to difficult-to-bond metals and retains its bond strength after exposure to moisture.&& Product Description Supplier Henkel Generic 环氧树脂 Material Status Commercial: Active Features Moisture…
About LOCTITE® PE 3142 Epoxy Resin forms a potting compound with high thermal conductivity when mixed with LOCTITE® PE 3162. This mixture forms a fast gelling, low viscosity, room temperature cure potting compound.&& Product Description Supplier Henkel Generic 环氧树脂 Material…
About Bromine epoxy Applications: It has automatic self extinguishing property. It is mainly used as fine retarding laminate plate, flame retardant adhesion agent, flame retardant integrated circuit printing plate, flame retardant paint, and coating, flame retardant powder coating.&& Product Description…
About A single component, silver-filled, B-stageable epoxy designed for semiconductor flip chip packaging or hybrid micro-electronic substrate attach or lid-sealing.&& Product Description Generic 环氧树脂 Material Status Commercial: Active Availabilitys Africa & Middle East ,North America,Asia Pacific,Europe Technical Data PHYSICAL Nominal…
About EPO-TEK® OG142 is a single component, UV curable epoxy, designed for adhesive, sealing, and encapsulating applications found in semiconductor, electro-optics, fiber optics, medical and scientific/OEM industries. It is a clear and colorless, high Tg epoxy.&& Product Description Generic 环氧树脂…
About EPO-TEK® E4110-PFC is a two-component, silver filled, electrically conductive adhesive designed for semiconductor IC packaging and general electronic assembly. It is a thixotropic version of EPO-TEK® E4110, suggested for applications requiring a screen printing process as well as jetting.&&…
About High Purity Epoxy Features: High Purity&& Product Description Generic 环氧树脂 Material Status Commercial: Active Features High purity Availabilitys Asia Pacific Technical Data PHYSICAL Nominal value Unit Test method colour < 0.40 G viscosity 25℃ 8.00 to 12.0 Pa·s Supplementary…
About EO1016 is an epoxy encapsulant intended for applications requiring excellent handling properties. The cured material survives severe thermal shock and offers continuous service to 177°C. It is particularly suited for use on transistors and similar semiconductors, can be used…
About A two component, flexible, optically opaque epoxy adhesive designed for optical, semiconductor and medical applications. Replacement for EPO-TEK® 310 Black.&& Product Description Generic 环氧树脂 Material Status Commercial: Active Features Good flexibility Availabilitys Africa & Middle East ,North America,Asia Pacific,Europe…
About INSULCAST 116 FR is a one to one ratio (weight or volume) epoxy potting and casting compound designed for production use. The convenient mixing ratio of the material makes it ideal for production line mixing as well as automatic…