EPO-TEK® H20E-8

About EPO-TEK ® H20E-8 is a two component, silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is a higher viscosity and higher thixotropic version of EPO-TEK® H20E.&& Product Description Generic 环氧树脂 Material Status Commercial:…

Thermoset Plastics EP-236

About Thermoset Plastics EP-236 is an Epoxy; Epoxide (Epoxy) material. It is available in North America for casting or encapsulating. Important attributes of Thermoset Plastics EP-236 are: Flame Rated Insulating Typical application of Thermoset Plastics EP-236: Wire & Cable&& Product…

Thermoset Plastics 267

About Thermoset Plastics 267 is an Epoxy; Epoxide (Epoxy) material. It is available in North America for coating. Typical application of Thermoset Plastics 267: Coating Applications&& Product Description Supplier Lord Generic 环氧树脂 Material Status Commercial: Active Features Thixotropic Availabilitys North…

EPO-TEK® 301-1

About A two component, room temperature curing, optical grade epoxy, designed for optics, medical, and opto-electronic packaging of semiconductor devices, components, and electronics. It is a lower viscosity version of EPO-TEK® 301.&& Product Description Generic 环氧树脂 Material Status Commercial: Active…

DAPCO™ 3041FR

About DAPCO™ 3041FR paste adhesive is a two-part, room temperature curing, epoxy-based, 100% solids, self-extinguishing general purpose adhesive. The material has a convenient one-to-one mix ratio by volume. The product is available in a variety of kit sizes including 50…

CMET TSR-829

About CMET TSR-829 is an Epoxy; Epoxide (Epoxy) material. It is available in Asia Pacific or North America for 3d printing, stereolithography.&& Product Description Generic 环氧树脂 Material Status Commercial: Active Availabilitys North America,Asia Pacific Technical Data PHYSICAL Nominal value Unit…

LOCTITE® Hysol KL G450H

About LOCTITE HYSOL KL G450H epoxy molding compound contains no bromine, antimony or phosphorus flame retardant. This material is designed to achieve JEDEC Level 3 requirements, at 260°C reflow temperature for a QFP package. LOCTITE HYSOL KL G450H meets UL…

Ultracast™ AP Red Label

About A series of low cost, high performance filled casting systems. Low shrink, low viscosity, one to one mix ratio, duplicating casting systems that reproduce the finest detail. These systems are easily machined, polished, and hand carved without excess wear…

CYCOM® 759F

About CYCOM® 759F is a modified epoxy resin system developed for applications where high quality surface finish and UV stability are important. It is ideal for use in automotive components where the carbon fabric is exposed to improve aesthetics. CYCOM…

KYOCERA KE-850SH

About Developed for Power Device Package that needs Good Heat Dissipation Through Molding Compound. Strong Points High Thermal Conductivity with Good Moldability, Excellent Moisture Resistance and Low Stress. Used in Auto Molding System by Rapid Cure Grades. KE-870 and KE-880…

DAPCO™ 3050

About DAPCO™ 3050 is a single component, self-extinguishing epoxy compound. Features & Benefits: Low shrinkage Low density Self-extinguishing Excellent adhesion to metals High heat distortion Good compressive strength Qualified to Bell’s 299-947-097 type 4 Suggested Applications: DAPCO 3050 is commonly…

Ad-Tech Epoxy EL-325-HTTC

About Ad-Tech Epoxy EL-325-HTTC is an Epoxy; Epoxide (Epoxy) product. It can be processed by laminating and is available in North America. Applications of Ad-Tech Epoxy EL-325-HTTC include coating applications, prototyping applications and tools. Primary characteristic: good dimensional stability.&& Product…

Thermoset Plastics EP-22

About Thermoset Plastics EP-22 is an Epoxy; Epoxide (Epoxy) material. It is available in North America for casting or encapsulating. Important attributes of Thermoset Plastics EP-22 are: Insulating Rigid Typical application of Thermoset Plastics EP-22: Wire & Cable&& Product Description…

E-Pos 542

About E-Pos 542 is a low viscosity epoxy resin which is based on bisphenol A and bisphenol F and which is diluted with an epoxidised alcohol reactive diluent. Product applications E-Pos 542 epoxy resin is used at room temperature in…

Thermoset Plastics 310

About Thermoset Plastics 310 is an Epoxy; Epoxide (Epoxy) material. It is available in North America for casting or encapsulating. Important attributes of Thermoset Plastics 310 are: Good Toughness Heat Resistant Insulating Rigid Typical application of Thermoset Plastics 310: Wire…

EPO-TEK® 360T

About A two component, high-temperature grade, electrically and thermally insulating epoxy for semiconductor, electronics, fiber optics and medical applications. It is a thixotropic paste for non-flow properties.&& Product Description Generic 环氧树脂 Material Status Commercial: Active Features Thermal insulation,Thixotropic,High Heat Resistance,Insulation…

CMET TSR-890

About CMET TSR-890 is an Epoxy; Epoxide (Epoxy) material. It is available in Asia Pacific or North America for 3d printing, stereolithography.&& Product Description Generic 环氧树脂 Material Status Commercial: Active Availabilitys North America,Asia Pacific Technical Data PHYSICAL Nominal value Unit…

Fixmaster 4 Minute Putty

About Fixmaster 4 Minute Putty是一种环氧; 环氧树脂产品,含有的填充物为钢填料。 它,在北美洲有供货。 Fixmaster 4 Minute Putty的应用领域包括修复材料、工业应用 和 食品接触应用。&& Product Description Supplier Henkel Generic 环氧树脂 Material Status Commercial: Active Features Machinable,Fast Cure Availabilitys North America Technical Data MECHANICAL Nominal value Unit Test method Shore hardness Shaw’s…

LOCTITE® EO7029

About LOCTITE EO7029 encapsulant is formulated for use in smart card applications. The thixotropic property of this material is designed to avoid flow during cure.&& Product Description Supplier Henkel Generic 环氧树脂 Material Status Commercial: Active Features Thixotropic,Baking,Fast Cure Availabilitys Africa…

Ebalta AH 120 / TL

About ebalta AH 120/TL is a very thin liquid epoxy resin with high values of strength and dimensional stability. Due to its good impregnating and wetting properties it is suitable as laminating resin for high-strength components with fabrics of glass…