About Glass-fibre reinforced and mineral filled epoxy moulding compound Good mechanical strength, very good electrical isolation properties even with thin wall thicknesses and high temperatures Primary application(s): electrical parts This product meets the allowed upper limits for heavy metals and…
About EPO-TEK® EJ2189-LV is an electrically conductive, silver-filled epoxy. This two component system is designed for reliable low temperature curing.&& Product Description Generic 环氧树脂 Material Status Commercial: Active Features Conductive,Good bond Availabilitys Africa & Middle East ,North America,Asia Pacific,Europe Technical…
About ebalta AH 100 is a very thin, unfilled epoxy resin, which can be used with different hardeners. Depending on the application the suitable hardener can be mixed with the resin AH 100. AH 100 / TGL is preferentially used…
About UV Cure 7155™ and 7156™ are low intensity UV Curable Epoxy Resins. These products are water clear and cure to a smooth, bubble free finish. Low cost, low intensity lights are all that is needed to cure these unique…
About EpoxAmite® 100 Epoxy Laminating System is an easy-to-use liquid epoxy system formulated for a wide variety of fabrication applications. EpoxAmite® 100 Laminating System is unfilled, low in viscosity, odorless and cures at room temperature. Cured epoxy displays exceptional physical…
About EPO-TEK® H35-175MPT is a single component, silver-filled epoxy for military hybrid die and component attach. Formerly B9119-1&& Product Description Generic 环氧树脂 Material Status Commercial: Active Features Conductive,Thixotropic,Low odor Availabilitys Africa & Middle East ,North America,Asia Pacific,Europe Technical Data PHYSICAL…
About Glass-fibre reinforced epoxy moulding compound Good mechanical strength, very good electrical isolation properties and dimensional stability even at high temperatures Primary application(s): Connectors, Thermocouples, Sensors, Resistors, Potentiometers This product meets the allowed upper limits for heavy metals and PCAs…
About TC-1600 A/B is an unfilled, low viscosity laminating epoxy resin for variety of fabricating applications. It features the ability to cure at room temperature for applications that do not require a working service temperature above 180°F (82?C). When post…
About Product Description Epoxy moulding compound, inorganically filled, glass fibre reinforced, highly heat resistant, good electrical properties, even at higher temperatures, very slight post shrinkage, increased media resistance, UL listed moulding compound 1.5 mm / HB (BK) Application Areas Electrical…
About CYCOM® 977-3 is a 350°F (177°C) curing resin. It is a toughened epoxy resin with 350°F (177°C) dry and 270°F (132°C) wet service capability. CYCOM 977-3 is formulated for autoclave or press molding and can be cured at 350°F…
About DAPCO™ 3008 is a two-component, self-extinguishing epoxy filler. Features & Benefits: Cure at room temperature Excellent adhesion to metal and wood Very low water absorption Good chemical resistance, especially to aircraft fluids Can be nailed, threaded, countersunk, drilled, cut,…
About HYDRIN® ELASTOMERS (CO/ECO/GECO), based on polyepichlorohydrin, have an excellent balance of properties for automobile applications. They exhibit notable low-temperature flexibility and adjustable dampening characteristics in addition to heat, oil and fuel resistance. More recently, Hydrin elastomers have shown a…
About Description: Epocast ® 938-A-2 epoxy structural syntactic is a frozen, one-component, flame-retardant compound designed for reinforcing honeycomb structures. Epocast® 938-A-2 epoxy syntactic features high compressive strength at temperatures to >350°F (177°C). When thawed, it can be extruded from cartridges…
About Thermoset Plastics DC-151 is an Epoxy; Epoxide (Epoxy) material. It is available in North America for laminating. Primary attribute of Thermoset Plastics DC-151: Impact Resistant. Typical application of Thermoset Plastics DC-151: Coating Applications&& Product Description Supplier Lord Generic 环氧树脂…
About 50-3182 NC is a highly filled epoxy system with excellent physical, electrical, and thermal properties. 50-3182 NC offers very high thermal conductivity, excellent electrical insulation, and low thermal expansion. This unique combination of properties makes this system ideal for…
About High Purity Epoxy Features: N.V. 80wt%, Solvent: MEK&& Product Description Generic 环氧树脂 Material Status Commercial: Active Features High purity Availabilitys Asia Pacific Technical Data PHYSICAL Nominal value Unit Test method colour < 0.50 G viscosity 25℃ 10.0 to 30.0…
About High Reliable and Easy-to-Use Molding Compounds for Various Type of Packages Strong Points Provide Various Molding Compounds with High Reliability to Cover Many Applications such as LSI, Transistors and Diodes. Good Curability and Applicable to Various Molding Machines (Both…
About HYSOL® US1151™ is a low viscosity, reenterable potting and encapsulation compound. It has excellent low temperature properties. Introduction of this material on a bed of 8-12 mesh sand increases thermal conductivity while decreasing shrinkage and cost. HYSOL® US1151™ can…
About EPO-TEK® TZ101 is a single component, electrically insulating, thermally conductive epoxy adhesive designed for heat-sinking of semiconductors, hybrids, electronics, and optics. Also available in a frozen syringe.&& Product Description Generic 环氧树脂 Material Status Commercial: Active Features Thixotropic,Thermal conductivity,Insulation Availabilitys…
About INSULGEL 50 FC Black is a room temperature curing epoxy gel. It is low in viscosity and does not normally require vacuum de-gassing to assure bubble-free castings.&& Product Description Generic 环氧树脂 Material Status Commercial: Active Features Low Viscosity Availabilitys…