DAPCO™ 3042

About
DAPCO™ 3042 fast curing paste adhesive is a two-part, room temperature curing, epoxy-based, 100% solids, self-extinguishing, composite edge filling and insert potting material. The material has a convenient one-to-one mix ratio by volume. The product is available in a variety of kit sizes including 50 ml, 200 mil and 400 ml side-by-side cartridges. Features & Benefits: Thixotropic flow properties 100% solids content Room temperature cure Room temperature storage 180°F (82°C) performance Meets FAR 25.853 Fast cure rate allowing quicker production Suggested Applications: DAPCO 3011 is commonly used for potting, stiffening and edge filling of honeycomb core.&&

Product Description
SupplierCytec Industries
Generic环氧树脂
Material StatusCommercial: Negative
FeaturesGood Rigidity,Thixotropic,Good bond,Self-extinguishing,Fast Cure
AvailabilitysNorth America

Technical Data
PHYSICALNominal valueUnitTest method
Density 
1.00g/cm³
1.10g/cm³
1.15g/cm³

THERMALNominal valueUnitTest method
Thermosetting components 
resin按重量计算的混合比: 1.0 
Hardening method按重量计算的混合比: 1.0 

MECHANICALNominal valueUnitTest method
Shore hardness
Shaw’s D70 to 80 
tensile strength
25℃24.1MPa
Tensile strain
fracture13%
compressive strength 
25℃55.2MPa
82℃8.96MPa
177℃3.45MPa

Notes
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