EPO-TEK® 301-1

About
A two component, room temperature curing, optical grade epoxy, designed for optics, medical, and opto-electronic packaging of semiconductor devices, components, and electronics. It is a lower viscosity version of EPO-TEK® 301.&&

Product Description
Generic环氧树脂
Material StatusCommercial: Active
FeaturesLow Viscosity
AvailabilitysAfrica & Middle East ,North America,Asia Pacific,Europe

Technical Data
optical performanceNominal valueUnitTest method
Refractive index1.517 
Transmittance 
400-1600 nm> 96.0%
1600-2000 nm> 92.0%

Supplementary informationNominal valueUnitTest method
Degradation Temperature390
Die Shear Strength(>5 kg,23℃)11.7MPa
working temperature 
Continuous-55 to 200
Intermittent-55 to 300
Storage Modulus(23℃)1.55GPa
Heating reduction 
200℃0.44%
250℃0.84%
300℃1.6%

Uncured PropertiesNominal valueUnitTest method
colour 
Clear/Transparent 
Density 
Part B0.868g/cm³
Part A1.14g/cm³
viscosity
23℃0.080 to 0.10Pa·s
Curing time
65℃2.0hr
storage stability60 to 120min

Cured PropertiesNominal valueUnitTest method
Shore hardness
Shaw’s D80 
lap shear strength
23℃7.58MPa
Relative permittivity
1 kHz4.26 
Volume resistivity
23℃> 3.0E+13ohms·cm
Dissipation factor
1 kHz0.021 

THERMALNominal valueUnitTest method
5.4E-5cm/cm/℃
1.8E-4cm/cm/℃
Glass transition temperature> 65.0
Linear coefficient of thermal expansion
MD 
Thermosetting components 
Component A按重量计算的混合比: 20 
Component B按重量计算的混合比: 5.0 
Storage period
23℃52wk

Notes
1. Typical properties: these are not to be construed as specifications.
2. Dynamic Cure 20-200°C/ISO 25 Min; Ramp -10-200°C @ 20°C/Min
3. Below Tg
4. Above Tg
5. 589 nm
6. Part B
7. Part A
8. 100 rpm
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