EPO-TEK® 730

About
EPO-TEK® 730 is a two component, thixotropic, room temperature-curing epoxy adhesive.&&

Product Description
Generic环氧树脂
Material StatusCommercial: Active

Technical Data
PHYSICALNominal valueUnitTest method
Particle size< 20.0µm

Supplementary informationNominal valueUnitTest method
Degradation Temperature364TGA
Die Shear Strength(>10 kg,23℃)23.4MPa
working temperature 
Continuous-55 to 150
Intermittent-55 to 250
Storage Modulus(23℃)852MPa
Thixotropic index2.10 
Heating reduction 
200℃1.4%
250℃2.2%
300℃4.2%

Uncured PropertiesNominal valueUnitTest method
colour 
Tan 
Density 
Part B0.938g/cm³
Part A1.12g/cm³
viscosity
23℃80 to 120Pa·s
Curing time
80℃2.0hr
storage stability60min

Cured PropertiesNominal valueUnitTest method
Shore hardness
Shaw’s D64 
lap shear strength
23℃> 13.8MPa
Relative permittivity
1 kHz3.17 
Volume resistivity
23℃> 3.0E+13ohms·cm
Dissipation factor
1 kHz0.021 

THERMALNominal valueUnitTest method
6.6E-5cm/cm/℃
2.5E-4cm/cm/℃
Glass transition temperature> 55.0
Linear coefficient of thermal expansion
MD 
Thermosetting components 
Component A按重量计算的混合比: 1.0 
Component B按重量计算的混合比: 1.0 
Storage period
23℃52wk

Notes
1. Typical properties: these are not to be construed as specifications.
2. Dynamic Cure 20-200°C/ISO 25 Min; Ramp -10-200°C @ 20°C/Min
3. Below Tg
4. Above Tg
5. Part B
6. Part A
7. 2.5 rpm
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