| About |
|---|
| A single component, thermally and electrically conductive, epoxy adhesive designed for semiconductor die attach and circuit assembly applications. Its unique features are a pot-life of several days, low temperature cure and syringe dispensing rheology. It can be used for electrical connections when bonding chips, SMDs, PCBs and substrates.&& |
| Product Description | |
|---|---|
| Generic | 环氧树脂 |
| Material Status | Commercial: Active |
| Features | Excellent Processability,Good liquidity,Lubricating,Heat Stabilized |
| Availabilitys | North America,Latin America,Asia Pacific,Europe |
| Process Methods | Injection Molding |
| Technical Data | |||
|---|---|---|---|
| PHYSICAL | Nominal value | Unit | Test method |
| Particle size | < 30.0 | µm | |
| Ionic type | |||
| Cl- | 80 | ppm | |
| K+ | 8 | ppm | |
| Na+ | 23 | ppm | |
| NH4+ | 41 | ppm | |
| Supplementary information | Nominal value | Unit | Test method |
|---|---|---|---|
| Degradation Temperature | 340 | ℃ | |
| Die Shear Strength（>5 kg，23℃） | 11.7 | MPa | |
| working temperature | |||
| Continuous | -55 to 175 | ℃ | |
| Intermittent | -55 to 275 | ℃ | |
| Storage Modulus（23℃） | 1.57 | GPa | |
| Thixotropic index | 3.20 | ||
| Heating reduction | |||
| 300℃ | 1.1 | % |
| Uncured Properties | Nominal value | Unit | Test method |
|---|---|---|---|
| colour | Silver | ||
| Density | 2.91 | g/cm³ | |
| viscosity | |||
| 23℃ | 11 to 19 | Pa·s | |
| Curing time | |||
| 150℃ | 1.0 | hr | |
| storage stability | 7200 | min |
| Cured Properties | Nominal value | Unit | Test method |
|---|---|---|---|
| Shore hardness | |||
| Shaw’s D | 71 | ||
| lap shear strength | |||
| 23℃ | 6.76 | MPa | |
| Volume resistivity | |||
| 23℃ | < 2.0E-4 | ohms·cm |
| THERMAL | Nominal value | Unit | Test method |
|---|---|---|---|
| Glass transition temperature | > 60.0 | ℃ | |
| Thermal conductivity coefficient | 1.2 | W/m/K | |
| Storage period | 52 | wk |
| Notes |
|---|
| 1. Typical properties: these are not to be construed as specifications. |
| 2. Dynamic Cure 20-200°C/ISO 25 Min; Ramp -10-200°C @ 20°C/Min |
| 3. Refrigerated |
| 4. 20 rpm |
| 【 Disclaimer 】 Guangzhou Soliao Information Technology Co., Ltd. reserves all rights. The information in this data table was obtained from the manufacturer of the material on soliao.com. Soliao.com makes every effort to ensure the accuracy of this data. However, the search company does not assume any responsibility for the uncertainty and consequences caused to users by these data values and suggestions, and strongly recommends verifying the data values with the material supplier before the final selection of materials. |