EPO-TEK® EK1000-1MP

About
A single component, electrically conductive epoxy with exceptionally high thermal conductivity making it perfect for power and thermal management. It is a longer dry-time version of EPO-TEK EK1000-MP and is designed for applications requiring long work times including hybrid die and component attach. Complies with the requirements of MIL-STD 883/Test Method 5011.&&

Product Description
Generic环氧树脂
Material StatusCommercial: Active
FeaturesConductive,Thermal conductivity
AvailabilitysAfrica & Middle East ,North America,Asia Pacific,Europe

Technical Data
PHYSICALNominal valueUnitTest method
Particle size< 45.0µm
Ionic type 
Cl-< 200ppm
K+< 50ppm
Na+< 50ppm
NH4+> 5ppm

Supplementary informationNominal valueUnitTest method
Degradation Temperature372
Die Shear Strength(>10 kg,23℃)23.4MPa
working temperature 
Continuous-55 to 200
Intermittent-55 to 300
Storage Modulus4.20GPa
Thixotropic index3.70 
Heating reduction 
200℃0.040%
250℃0.15%
300℃0.50%

Uncured PropertiesNominal valueUnitTest method
colourSilver 
Density3.75g/cm³
viscosity
23℃17Pa·s
Curing time
200℃1.0hr
storage stability20000min

Cured PropertiesNominal valueUnitTest method
Shore hardness
Shaw’s D65 
Volume resistivity
25 ℃7.0E-5ohms·cm

THERMALNominal valueUnitTest method
4.1E-5cm/cm/℃
1.6E-4cm/cm/℃
Glass transition temperature103
Linear coefficient of thermal expansion
MD 
Thermal conductivity coefficient23W/m/K
Storage period
-40℃52wk
drying time< 7.0day

Notes
1. Typical properties: these are not to be construed as specifications.
2. Below Tg
3. Above Tg
4. 150°C/1 Hour+200°C/1 Hour Cure
5. 10 rpm
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