About |
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A single component, electrically conductive epoxy with exceptionally high thermal conductivity making it perfect for power and thermal management. It is a longer dry-time version of EPO-TEK EK1000-MP and is designed for applications requiring long work times including hybrid die and component attach. Complies with the requirements of MIL-STD 883/Test Method 5011.&& |
Product Description | |
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Generic | 环氧树脂 |
Material Status | Commercial: Active |
Features | Conductive,Thermal conductivity |
Availabilitys | Africa & Middle East ,North America,Asia Pacific,Europe |
Technical Data | |||
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PHYSICAL | Nominal value | Unit | Test method |
Particle size | < 45.0 | µm | |
Ionic type | |||
Cl- | < 200 | ppm | |
K+ | < 50 | ppm | |
Na+ | < 50 | ppm | |
NH4+ | > 5 | ppm |
Supplementary information | Nominal value | Unit | Test method |
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Degradation Temperature | 372 | ℃ | |
Die Shear Strength(>10 kg,23℃) | 23.4 | MPa | |
working temperature | |||
Continuous | -55 to 200 | ℃ | |
Intermittent | -55 to 300 | ℃ | |
Storage Modulus | 4.20 | GPa | |
Thixotropic index | 3.70 | ||
Heating reduction | |||
200℃ | 0.040 | % | |
250℃ | 0.15 | % | |
300℃ | 0.50 | % |
Uncured Properties | Nominal value | Unit | Test method |
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colour | Silver | ||
Density | 3.75 | g/cm³ | |
viscosity | |||
23℃ | 17 | Pa·s | |
Curing time | |||
200℃ | 1.0 | hr | |
storage stability | 20000 | min |
Cured Properties | Nominal value | Unit | Test method |
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Shore hardness | |||
Shaw’s D | 65 | ||
Volume resistivity | |||
25 ℃ | 7.0E-5 | ohms·cm |
THERMAL | Nominal value | Unit | Test method |
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— | 4.1E-5 | cm/cm/℃ | |
— | 1.6E-4 | cm/cm/℃ | |
Glass transition temperature | 103 | ℃ | |
Linear coefficient of thermal expansion | |||
MD | |||
Thermal conductivity coefficient | 23 | W/m/K | |
Storage period | |||
-40℃ | 52 | wk | |
drying time | < 7.0 | day |
Notes |
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1. Typical properties: these are not to be construed as specifications. |
2. Below Tg |
3. Above Tg |
4. 150°C/1 Hour+200°C/1 Hour Cure |
5. 10 rpm |
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