| About |
|---|
| A single component, thixotropic, electrically and thermally insulating epoxy adhesive designed for bonding SMDs to the PCB. It can be used for electronic assembly in many devices including consumer electronics, cell phone, telecommunications, medical, automotive, and scientific/OEM. It is a red color version of EPO-TEK® 115-SMT.&& |
| Product Description | |
|---|---|
| Generic | 环氧树脂 |
| Material Status | Commercial: Active |
| Features | Thermal insulation,Thixotropic,Insulation |
| Availabilitys | Africa & Middle East ,North America,Asia Pacific,Europe |
| Technical Data | |||
|---|---|---|---|
| PHYSICAL | Nominal value | Unit | Test method |
| Particle size | < 20.0 | µm | |
| Supplementary information | Nominal value | Unit | Test method |
|---|---|---|---|
| Degradation Temperature | 344 | ℃ | |
| Die Shear Strength（>5 kg，23℃） | 11.7 | MPa | |
| working temperature | |||
| Continuous | -55 to 175 | ℃ | |
| Intermittent | -55 to 275 | ℃ | |
| Storage Modulus（23℃） | 3.02 | GPa | |
| Heating reduction | |||
| 200℃ | 0.27 | % | |
| 250℃ | 1.1 | % | |
| 300℃ | 3.0 | % |
| Uncured Properties | Nominal value | Unit | Test method |
|---|---|---|---|
| colour | Red | ||
| Density | 1.15 | g/cm³ | |
| viscosity | |||
| 23℃ | 200 to 300 | Pa·s | |
| Curing time | |||
| 150℃ | 1.0 | hr | |
| storage stability | 40000 | min |
| Cured Properties | Nominal value | Unit | Test method |
|---|---|---|---|
| Shore hardness | |||
| Shaw’s D | 80 | ||
| lap shear strength | |||
| 23℃ | 10.8 | MPa | |
| Relative permittivity | |||
| 1 kHz | 3.48 | ||
| Volume resistivity | |||
| 23℃ | > 7.0E+13 | ohms·cm | |
| Dissipation factor | |||
| 1 kHz | 7.0E-3 |
| THERMAL | Nominal value | Unit | Test method |
|---|---|---|---|
| — | 4.1E-5 | cm/cm/℃ | |
| — | 2.2E-4 | cm/cm/℃ | |
| Glass transition temperature | > 65.0 | ℃ | |
| Linear coefficient of thermal expansion | |||
| MD | |||
| Storage period | |||
| -40℃ | 52 | wk |
| Notes |
|---|
| 1. Typical properties: these are not to be construed as specifications. |
| 2. Dynamic Cure 20-200°C/ISO 25 Min; Ramp -10-200°C @ 20°C/Min |
| 3. Below Tg |
| 4. Above Tg |
| 5. 1 rpm |
| 【 Disclaimer 】 Guangzhou Soliao Information Technology Co., Ltd. reserves all rights. The information in this data table was obtained from the manufacturer of the material on soliao.com. Soliao.com makes every effort to ensure the accuracy of this data. However, the search company does not assume any responsibility for the uncertainty and consequences caused to users by these data values and suggestions, and strongly recommends verifying the data values with the material supplier before the final selection of materials. |