| About |
|---|
| EPO-TEK® H20E is a two component, 100% solids silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is also used extensively for thermal management applications due to its high thermal conductivity. It has proven itself to be extremely reliable over many years of service and is still the conductive adhesive of choice for new applications. Also available in a single component frozen syringe.&& |
| Product Description | |
|---|---|
| Generic | 环氧树脂 |
| Material Status | Commercial: Active |
| Features | Conductive,Biocompatible,Thixotropic,Low odor,EMI,RFI,Thermal conductivity |
| Availabilitys | Africa & Middle East ,North America,Asia Pacific,Europe |
| Technical Data | |||
|---|---|---|---|
| PHYSICAL | Nominal value | Unit | Test method |
| Particle size | < 45.0 | µm | |
| Ionic type | |||
| Cl- | 73 | ppm | |
| K+ | 3 | ppm | |
| Na+ | 2 | ppm | |
| NH4+ | 98 | ppm | |
| Supplementary information | Nominal value | Unit | Test method |
|---|---|---|---|
| Degradation Temperature | 425 | ℃ | TGA |
| Die Shear Strength（>10 kg，23℃） | 23.4 | MPa | |
| working temperature | |||
| Continuous | -55 to 200 | ℃ | |
| Intermittent | -55 to 300 | ℃ | |
| Storage Modulus（23℃） | 5.58 | GPa | |
| Thixotropic index | 4.63 | ||
| Heating reduction | |||
| 200℃ | 0.59 | % | |
| 250℃ | 1.1 | % | |
| 300℃ | 1.7 | % |
| Uncured Properties | Nominal value | Unit | Test method |
|---|---|---|---|
| colour | |||
| — | Silver | ||
| Density | |||
| Part A | 2.02 | g/cm³ | |
| Part B | 3.06 | g/cm³ | |
| viscosity | |||
| 23℃ | 2.2 to 3.2 | Pa·s | |
| Curing time | |||
| 150℃ | 1.0 | hr | |
| storage stability | 3600 | min |
| Cured Properties | Nominal value | Unit | Test method |
|---|---|---|---|
| Shore hardness | |||
| Shaw’s D | 75 | ||
| lap shear strength | |||
| 23℃ | 10.2 | MPa | |
| Volume resistivity | |||
| 23℃ | < 4.0E-4 | ohms·cm |
| THERMAL | Nominal value | Unit | Test method |
|---|---|---|---|
| — | 3.1E-5 | cm/cm/℃ | |
| — | 1.6E-4 | cm/cm/℃ | |
| Glass transition temperature | > 80.0 | ℃ | |
| Linear coefficient of thermal expansion | |||
| MD | |||
| Thermal conductivity coefficient | |||
| — | 2.5 | W/m/K | |
| — | 29 | W/m/K | |
| Thermosetting components | |||
| Component A | 按重量计算的混合比: 1.0 | ||
| Component B | 按重量计算的混合比: 1.0 | ||
| Storage period | |||
| 23℃ | 52 | wk |
| Notes |
|---|
| 1. Typical properties: these are not to be construed as specifications. |
| 2. Dynamic Cure 20-200°C/ISO 25 Min; Ramp -10-200°C @ 20°C/Min |
| 3. Below Tg |
| 4. Above Tg |
| 5. Based on standard method: Laser Flash |
| 6. Based on Thermal Resistance Data: R = L x K^-1 x A^-1 |
| 7. Part B |
| 8. Part A |
| 9. 100 rpm |
| 【 Disclaimer 】 Guangzhou Soliao Information Technology Co., Ltd. reserves all rights. The information in this data table was obtained from the manufacturer of the material on soliao.com. Soliao.com makes every effort to ensure the accuracy of this data. However, the search company does not assume any responsibility for the uncertainty and consequences caused to users by these data values and suggestions, and strongly recommends verifying the data values with the material supplier before the final selection of materials. |