EPO-TEK® H20F

About
EPO-TEK® H20F is a two component, flexible silver epoxy. It was designed for flexible type circuitry, such as switching circuits in a flexible panel system, as well as large die-attach or substrate attach.&&

Product Description
Generic环氧树脂
Material StatusCommercial: Active
FeaturesGood flexibility,Conductive,Thixotropic
AvailabilitysAfrica & Middle East ,North America,Asia Pacific,Europe

Technical Data
PHYSICALNominal valueUnitTest method
Particle size< 45.0µm

Supplementary informationNominal valueUnitTest method
Degradation Temperature384TGA
Die Shear Strength(>2 kg,23℃)4.69MPa
working temperature 
Continuous-55 to 175
Intermittent-55 to 275
Storage Modulus(23℃)146MPa
Thixotropic index4.00 
Heating reduction 
200℃0.51%
250℃0.78%
300℃1.8%

Uncured PropertiesNominal valueUnitTest method
colour 
Silver 
Density 
Part A2.50g/cm³
Part B3.55g/cm³
viscosity
23℃1.5 to 3.0Pa·s
Curing time
150℃1.0hr
storage stability2200min

Cured PropertiesNominal valueUnitTest method
Shore hardness
Shaw’s A46 
Volume resistivity
23℃< 1.0E-4ohms·cm

THERMALNominal valueUnitTest method
Glass transition temperature> 20.0
Linear coefficient of thermal expansion
MD1.0E-51/℃
Thermal conductivity coefficient4.1W/m/K
Thermosetting components 
Component A按重量计算的混合比: 1.0 
Component B按重量计算的混合比: 1.0 
Storage period
23℃52wk

Notes
1. Typical properties: these are not to be construed as specifications.
2. Dynamic Cure 20-200°C/ISO 25 Min; Ramp -10-200°C @ 20°C/Min
3. Below Tg
4. Part B
5. Part A
6. 100 rpm
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