| About |
|---|
| EPO-TEK® H20S is a modified version of EPO-TEK® H20E, designed primarily for die stamping and dispensing techniques for chip bonding. EPO-TEK® H20S is a highly reliable, two component, silver-filled epoxy with a smooth, thixotropic consistency. In addition to the high electrical conductivity, the short curing cycles, the proven reliability, and the convenient mix ratio, EPO-TEK® H20S is extremely simple to use.&& |
| Product Description | |
|---|---|
| Generic | 环氧树脂 |
| Material Status | Commercial: Active |
| Features | Conductive,Thixotropic,EMI,RFI,Fast Cure |
| Availabilitys | Africa & Middle East ,North America,Asia Pacific,Europe |
| Technical Data | |||
|---|---|---|---|
| PHYSICAL | Nominal value | Unit | Test method |
| Particle size | < 20.0 | µm | |
| Ionic type | |||
| Cl- | 162 | ppm | |
| K+ | 4 | ppm | |
| Na+ | 0 | ppm | |
| NH4+ | 282 | ppm | |
| Supplementary information | Nominal value | Unit | Test method |
|---|---|---|---|
| Degradation Temperature | 414 | ℃ | TGA |
| Die Shear Strength（>5 kg，23℃） | 11.7 | MPa | |
| working temperature | |||
| Continuous | -55 to 200 | ℃ | |
| Intermittent | -55 to 300 | ℃ | |
| Storage Modulus（23℃） | 2.34 | GPa | |
| Thixotropic index | 5.00 | ||
| Heating reduction | |||
| 200℃ | 0.40 | % | |
| 250℃ | 0.60 | % | |
| 300℃ | 1.4 | % |
| Uncured Properties | Nominal value | Unit | Test method |
|---|---|---|---|
| colour | |||
| — | Silver | ||
| Density | |||
| Part A | 1.74 | g/cm³ | |
| Part B | 3.06 | g/cm³ | |
| viscosity | |||
| 23℃ | 1.8 to 2.8 | Pa·s | |
| Curing time | |||
| 150℃ | 1.0 | hr | |
| storage stability | 4300 | min |
| Cured Properties | Nominal value | Unit | Test method |
|---|---|---|---|
| Shore hardness | |||
| Shaw’s D | 64 | ||
| lap shear strength | |||
| 23℃ | 8.55 | MPa | |
| Volume resistivity | |||
| 23℃ | < 5.0E-4 | ohms·cm |
| THERMAL | Nominal value | Unit | Test method |
|---|---|---|---|
| — | 3.1E-5 | cm/cm/℃ | |
| — | 1.2E-4 | cm/cm/℃ | |
| Glass transition temperature | > 80.0 | ℃ | |
| Linear coefficient of thermal expansion | |||
| MD | |||
| Thermal conductivity coefficient | 3.3 | W/m/K | |
| Thermosetting components | |||
| Component A | 按重量计算的混合比: 1.0 | ||
| Component B | 按重量计算的混合比: 1.0 | ||
| Storage period | |||
| 23℃ | 52 | wk |
| Notes |
|---|
| 1. Typical properties: these are not to be construed as specifications. |
| 2. Dynamic Cure 20-200°C/ISO 25 Min; Ramp -10-200°C @ 20°C/Min |
| 3. Below Tg |
| 4. Above Tg |
| 5. Part B |
| 6. Part A |
| 7. 100 rpm |
| 【 Disclaimer 】 Guangzhou Soliao Information Technology Co., Ltd. reserves all rights. The information in this data table was obtained from the manufacturer of the material on soliao.com. Soliao.com makes every effort to ensure the accuracy of this data. However, the search company does not assume any responsibility for the uncertainty and consequences caused to users by these data values and suggestions, and strongly recommends verifying the data values with the material supplier before the final selection of materials. |