EPO-TEK® OG133-8

About
A single component, UV curable, thixotropic flexible epoxy adhesive/encapsulant designed for semiconductor and opto-electronic packaging. Glob top over IC and wire bonds, and low stress bonding of fiber optic components, are common applications. It is a replacement for EPO-TEK® OG133-5, and a non-flow version of EPO-TEK® OG133-7. Formerly 90-36-4&&

Product Description
Generic环氧树脂
Material StatusCommercial: Active
FeaturesGood flexibility,Thixotropic,UV Cure
AvailabilitysAfrica & Middle East ,North America,Asia Pacific,Europe

Technical Data
PHYSICALNominal valueUnitTest method
Particle size< 10.0µm

optical performanceNominal valueUnitTest method
Refractive index 
1.504 
1.524 
Transmittance 
640 nm> 90.0%
900 nm> 95.0%

Supplementary informationNominal valueUnitTest method
Degradation Temperature353
working temperature 
Continuous-55 to 150
Intermittent-55 to 250
Storage Modulus< 6.89MPa
Thixotropic index3.10 
Heating reduction 
200℃2.4%
250℃3.6%
300℃5.7%

Uncured PropertiesNominal valueUnitTest method
colourWhite 
Density1.13g/cm³
viscosity
23℃1.0 to 1.5Pa·s

Cured PropertiesNominal valueUnitTest method
Shore hardness
Shaw’s A65 

THERMALNominal valueUnitTest method
4.3E-5cm/cm/℃
2.2E-4cm/cm/℃
Glass transition temperature< 10.0
Linear coefficient of thermal expansion
MD 
Storage period
23℃52wk

Notes
1. Typical properties: these are not to be construed as specifications.
2. Dynamic Cure 20-200°C/ISO 25 Min; Ramp -10-200°C @ 20°C/Min
3. Below Tg
4. Above Tg
5. 589 nm (uncured)
6. 589 nm (cured)
7. 100 rpm
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