EPO-TEK® TD1001

About
EPO-TEK® TD1001 is a single component, thermally conductive, electrically insulating epoxy designed for low stress semiconductor and electronics packaging.&&

Product Description
Generic环氧树脂
Material StatusCommercial: Active
FeaturesThixotropic,Good bond,Thermal conductivity,Insulation
AvailabilitysAfrica & Middle East ,North America,Asia Pacific,Europe

Technical Data
PHYSICALNominal valueUnitTest method
Particle sizeµm

Supplementary informationNominal valueUnitTest method
Degradation Temperature436TGA
Die Shear Strength(>15 kg,23℃)35.2MPa
working temperature
Continuous-55 to 225
Intermittent-55 to 325
Storage Modulus(23℃)1.98GPa
Thixotropic index4.10
Heating reduction
200℃%
250℃0.14%
300℃0.44%

Uncured PropertiesNominal valueUnitTest method
colourWhite
Density1.20g/cm³
viscosity
23℃10 to 22Pa·s
Curing time
125℃> 1.0hr
storage stability40000min

Cured PropertiesNominal valueUnitTest method
Shore hardness
Shaw’s D85
lap shear strength
23℃> 13.8MPa
Relative permittivity
1 kHz3.12
Volume resistivity
23℃> 2.0E+13ohms·cm
Dissipation factor
1 kHz0.010

THERMALNominal valueUnitTest method
5.7E-5cm/cm/℃
2.1E-4cm/cm/℃
Glass transition temperature> 40.0
Linear coefficient of thermal expansion
MD
Thermal conductivity coefficient0.77W/m/K
Storage period
-40℃52wk

Notes
1. Typical properties: these are not to be construed as specifications.
2. Dynamic Cure 20-200°C/ISO 25 Min; Ramp -10-200°C @ 20°C/Min
3. Below Tg
4. Above Tg
5. 5 rpm
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