| About |
|---|
| 20-3035 is a low density, two component epoxy potting and encapsulating system. The 20-3035 is less than half the weight of most commercially available potting compounds. 20-3035 exhibits very low shrinkage during the cure cycle and also has a low coefficient of thermal expansion. This unique epoxy system is an ideal material for the potting of electronic assemblies where a low dielectric constant and low weight are required. This epoxy syntactic foam system utilizes an advanced micro balloon technology filler. The 20-3035 provides high strength and stiffness, thermal and environmental stability, creep resistance, and water resistance. Features: Low Dielectric Constant Low Coefficient of Thermal Expansion Low Shrinkage Low Density Excellent Moisture Resistance&& |
| Product Description | |
|---|---|
| Generic | 环氧树脂 |
| Material Status | Commercial: Active |
| Features | Good Rigidity,Good flexibility,Low or no water absorption,Low contractility,Low density,Heat Stabilized |
| Availabilitys | Africa & Middle East ,North America,Latin America,Asia Pacific,Europe |
| Technical Data | |||
|---|---|---|---|
| PHYSICAL | Nominal value | Unit | Test method |
| Shrinkage rate | |||
| MD | 0.10 | % | |
| MECHANICAL | Nominal value | Unit | Test method |
|---|---|---|---|
| bending strength | 34.5 | MPa |
| THERMAL | Nominal value | Unit | Test method |
|---|---|---|---|
| Linear coefficient of thermal expansion | |||
| MD | 4.3E-5 | 1/℃ | |
| Thermal conductivity coefficient | 0.19 | W/m/K |
| Thermosetting mixed viscosity | Nominal value | Unit | Test method |
|---|---|---|---|
| 25℃ | 5000 | cP |
| Supplementary information | Nominal value | Unit | Test method |
|---|---|---|---|
| working temperature | -65.0 to 105 | ℃ | |
| Outgassing | |||
| % CVCM | 0.0900 | ||
| % TMLV | 0.740 |
| Uncured Properties | Nominal value | Unit | Test method |
|---|---|---|---|
| Weight Mix Ratio (PBW) | |||
| Part A | 100 | ||
| Part B | 23 | ||
| Density | |||
| 25℃ | 0.838 | g/cm³ | |
| viscosity | |||
| 25℃ | 45 | Pa·s | |
| Curing time | |||
| 65℃ | 1.0 to 2.0 | hr | |
| 45℃ | 4.0 to 6.0 | hr | |
| 25℃ | 16 to 24 | hr | |
| storage stability | |||
| 25 ℃ | 30 | min |
| Cured Properties | Nominal value | Unit | Test method |
|---|---|---|---|
| Water absorption rate | 0.40 | % | |
| Shore hardness | |||
| Shaw’s D | 78 | ||
| tensile strength | 29.6 | MPa | |
| compressive strength | 68.9 | MPa | |
| Electrical strength | 15 | kV/mm | |
| Relative permittivity | |||
| 1 MHz | 2.90 | ||
| Volume resistivity | |||
| 25 ℃ | > 1.0E+13 | ohms·cm | |
| Dissipation factor | |||
| 1 MHz | 0.050 |
| Notes |
|---|
| 1. Typical properties: these are not to be construed as specifications. |
| 2. Part A |
| 3. 100 grams |
| 4. After 24 hours |
| 【 Disclaimer 】 Guangzhou Soliao Information Technology Co., Ltd. reserves all rights. The information in this data table was obtained from the manufacturer of the material on soliao.com. Soliao.com makes every effort to ensure the accuracy of this data. However, the search company does not assume any responsibility for the uncertainty and consequences caused to users by these data values and suggestions, and strongly recommends verifying the data values with the material supplier before the final selection of materials. |