Hysol® EO1016

About
EO1016 is an epoxy encapsulant intended for applications requiring excellent handling properties. The cured material survives severe thermal shock and offers continuous service to 177°C. It is particularly suited for use on transistors and similar semiconductors, can be used for encapsulation of watch ICs.&&

Product Description
SupplierHenkel
Generic环氧树脂
Material StatusCommercial: Active
FeaturesBaking,Good thermal shock resistance,Fast Cure
AvailabilitysAfrica & Middle East ,North America,Latin America,Asia Pacific,Europe

Technical Data
PHYSICALNominal valueUnitTest method
Water absorption rate
25℃,24hr0.060%
50℃,24hr0.23%

THERMALNominal valueUnitTest method
Glass transition temperature126
Linear coefficient of thermal expansion
MD
< 126℃4.6E-5cm/cm/℃
> 126℃1.4E-4cm/cm/℃
Thermal conductivity coefficient0.39W/m/K

Electrical performanceNominal valueUnitTest method
Surface resistivity1.0E+16ohmsIEC 60093
Volume resistivity6.0E+15ohms·cmIEC 60093
Dielectric constant
25 ℃,1 kHz4.30 IEC 60250
Dissipation factor
25℃,1 kHz8.4E-3 IEC 60250
Arc resistance180secASTM D495

Supplementary informationNominal valueUnitTest method
Extractable ion content
Chloride1ppm
Thixotropic index1.10 

Uncured PropertiesNominal valueUnitTest method
Density
25℃1.56g/cm³
viscosity
Brookfield RVF, 25 ℃58Pa·s
Brookfield RVF, 25 ℃62Pa·s
Curing time
150℃0.33hr
Gelation time
121℃4.5min
storage stability
25 ℃130000min
Storage period
4℃12month
-40℃12month

MECHANICALNominal valueUnitTest method
Shore hardness
Shaw’s D> 86 
tensile strength55.2MPa
Tensile strain
fracture1.8%
Bending modulus5880MPa
bending strength100MPa

Notes
1. Typical properties: these are not to be construed as specifications.
2. Spindle 6, speed 20 rpm
3. Spindle 6, speed 2 rpm
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