| About |
|---|
| SBNA INSUL-PLATE™ Hole-Fill material delivers true reliability and superior performance. This material, in powder form, is specifically suited for Hole-Fill use in glass epoxy, multi-layer and polyimide metal core circuit boards. The material is designed to meet or exceed the higher process and post-cure temperatures required for polyimide prepregs. SBNA Hole-Fill powder offers excellent adhesion to the metal core plates while maintaining the required mechanical and electrical properties. In addition, INSUL-PLATE material readily accepts plating with excellent adhesion. Vyncolit monitors the material on a lot-to-lot basis to assure a consistent product and to provide the high reliability required for metal core and multi-layer board applications.&& |
| Product Description | |
|---|---|
| Supplier | SBHPP |
| Generic | 环氧树脂 |
| Material Status | Commercial: Active |
| Features | Low contractility,Machinable,Good bond,Electroplating,Solvent resistance,Insulation |
| Availabilitys | North America |
| Technical Data | |||
|---|---|---|---|
| PHYSICAL | Nominal value | Unit | Test method |
| Density | 1.99 | g/cm³ | ASTM D792 |
| Shrinkage rate | |||
| MD | 0.60 | % | ASTM D955 |
| Water absorption rate | |||
| 50℃，48hr | 0.20 | % | ASTM D570 |
| 23℃，24hr | 0.060 | % | ASTM D570 |
| Bulk Factor | 3.00 to 4.00 | ASTM D954 | |
| MECHANICAL | Nominal value | Unit | Test method |
|---|---|---|---|
| tensile strength | 51.7 | MPa | ASTM D638 |
| Bending modulus | 13800 | MPa | ASTM D790 |
| bending strength | 96.0 | MPa | ASTM D790 |
| compressive strength | 172 | MPa | ASTM D695 |
| IMPACT | Nominal value | Unit | Test method |
|---|---|---|---|
| Impact strength of cantilever beam notch | 18 | J/m | ASTM D256 |
| Electrical performance | Nominal value | Unit | Test method |
|---|---|---|---|
| Volume resistivity | 1.0E+14 | ohms·cm | ASTM D257 |
| Dielectric strength | 14 | kV/mm | ASTM D149 |
| Dielectric constant | |||
| 1 MHz | 5.25 | ASTM D150 | |
| Dissipation factor | |||
| 1 MHz | 8.0E-3 | ASTM D150 | |
| Arc resistance | 180 | sec | ASTM D495 |
| insulation resistance | 1.0E+15 | ohms·cm | ASTM D257 |
| Supplementary information | Nominal value | Unit | Test method |
|---|---|---|---|
| Compression molding pressure | 1.38 to 13.8 | MPa | |
| Compression molding temperature | 143 to 177 | ℃ |
| THERMAL | Nominal value | Unit | Test method |
|---|---|---|---|
| 40 to 125 ℃ | 2.5E-5 | cm/cm/℃ | ASTM E831 |
| 40 to 125 ℃ | 2.9E-5 | cm/cm/℃ | ASTM E831 |
| 40 to 190 ℃ | 2.8E-5 | cm/cm/℃ | ASTM E831 |
| Glass transition temperature | 177 | ℃ | |
| Linear coefficient of thermal expansion | |||
| MD | ASTM E831 | ||
| Thermal conductivity coefficient | 0.63 | W/m/K | ASTM C518 |
| Storage period | |||
| 4℃ | > 26 | wk |
| Notes |
|---|
| 1. Typical properties: these are not to be construed as specifications. |
| 2. Post Cured |
| 3. As Molded |
| 4. Method A (Short-Time) |
| 5. Dry |
| 【 Disclaimer 】 Guangzhou Soliao Information Technology Co., Ltd. reserves all rights. The information in this data table was obtained from the manufacturer of the material on soliao.com. Soliao.com makes every effort to ensure the accuracy of this data. However, the search company does not assume any responsibility for the uncertainty and consequences caused to users by these data values and suggestions, and strongly recommends verifying the data values with the material supplier before the final selection of materials. |