| About |
|---|
| Developed for Power Device Package that needs Good Heat Dissipation Through Molding Compound. Strong Points High Thermal Conductivity with Good Moldability, Excellent Moisture Resistance and Low Stress. Used in Auto Molding System by Rapid Cure Grades. KE-870 and KE-880 is Formulated with Special High Thermal Conductivity Filler System and Achieve High Thermal Conductivity (above 3W/m K). Application Isolation Packages such as TO-220 and TO-3P that need Heat Dissipation Characteristics. Packages for High Heating Volume such as Power Module.&& |
| Product Description | |
|---|---|
| Supplier | KYOCERA |
| Generic | 环氧树脂 |
| Material Status | Commercial: Active |
| Features | Excellent Processability,Moisture resistance,Thermal conductivity |
| Availabilitys | Asia Pacific |
| Technical Data | |||
|---|---|---|---|
| PHYSICAL | Nominal value | Unit | Test method |
| Density | 2.19 | g/cm³ | |
| Spiral flow length | 35.0 | cm | |
| THERMAL | Nominal value | Unit | Test method |
|---|---|---|---|
| Glass transition temperature | 175 | ℃ | |
| Linear coefficient of thermal expansion | |||
| MD | |||
| — | 2.2E-5 | cm/cm/℃ | |
| — | 5.9E-5 | cm/cm/℃ | |
| Thermal conductivity coefficient | 2.3 | W/m/K |
| Uncured Properties | Nominal value | Unit | Test method |
|---|---|---|---|
| Gelation time | 0.42 | min |
| Notes |
|---|
| 1. Typical properties: these are not to be construed as specifications. |
| 2. Alpha 1 |
| 3. Alpha 2 |
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