| About |
|---|
| Special Epoxy Molding Compounds Optimizing Warpage and Applicable to Fine Pitch Wire for BGA Package Strong Points Less Warpage in All Types of Area Array Packages due to High Tg Characteristic. Applicable to Fine Pitch Wire Bonding with Good Wire Sweep Performance. Achieve High Yield after Molding due to Excellent Moldability that allows its application to MAP. Application Standard P-BGA, HS-BGA and LGA Package. Multi Chip Module (Stacked or Side by Side Layout) IC Card, Memory Card etc. Low Alpha Ray Type: KE-G2250 LKDS&& |
| Product Description | |
|---|---|
| Supplier | KYOCERA |
| Generic | 环氧树脂 |
| Material Status | Commercial: Active |
| Features | Excellent Processability |
| Availabilitys | Asia Pacific |
| Technical Data | |||
|---|---|---|---|
| PHYSICAL | Nominal value | Unit | Test method |
| Density | 2.00 | g/cm³ | |
| Spiral flow length | 180 | cm | |
| Solution viscosity | 7000 | mPa·s | |
| MECHANICAL | Nominal value | Unit | Test method |
|---|---|---|---|
| Bending modulus | 25000 | MPa | |
| bending strength | 180 | MPa |
| THERMAL | Nominal value | Unit | Test method |
|---|---|---|---|
| Glass transition temperature | 130 | ℃ | |
| Linear coefficient of thermal expansion | |||
| MD | |||
| — | 8.0E-6 | cm/cm/℃ | |
| — | 3.2E-5 | cm/cm/℃ |
| Notes |
|---|
| 【 Disclaimer 】 Guangzhou Soliao Information Technology Co., Ltd. reserves all rights. The information in this data table was obtained from the manufacturer of the material on soliao.com. Soliao.com makes every effort to ensure the accuracy of this data. However, the search company does not assume any responsibility for the uncertainty and consequences caused to users by these data values and suggestions, and strongly recommends verifying the data values with the material supplier before the final selection of materials. |