LOCTITE® Hysol GR 725LV

About
LOCTITE HYSOL GR 725LV is a semiconductor grade molding compound designed for power package applications. This material is designed to achieve high JEDEC MSL requirements, at 260°C reflow temperature.&&

Product Description
SupplierHenkel
Generic环氧树脂
Material StatusCommercial: Active
FeaturesFlame Characteristics,Good bond,Baking
AvailabilitysAfrica & Middle East ,North America,Latin America,Asia Pacific,Europe

Technical Data
PHYSICALNominal valueUnitTest method
Density1.91g/cm³
Spiral flow length105cm
Shrinkage rate
MD0.40%
Water absorption rate
85℃,7days,85% RH0.36%

Electrical performanceNominal valueUnitTest method
Volume resistivity
25 ℃7.8E+15ohms·cm

FLAME CHARACTERISTICSNominal valueUnitTest method
Flame retardant level
3.20 mmV-0 UL 94

Supplementary informationNominal valueUnitTest method
Extractable ion content
Chloride8ppm
Sodium3ppm

Uncured PropertiesNominal valueUnitTest method
Curing time
175℃0.014 to 0.025hr
175℃0.019 to 0.028hr
Gelation time
175℃0.38min
Storage period
5℃6month

MECHANICALNominal valueUnitTest method
Shore hardness
Shaw’s D, 175 ℃85 
Bending modulus
25℃19600MPa
bending strength
25℃137MPa

THERMALNominal valueUnitTest method
< 140℃1.0E-5cm/cm/℃
> 140℃6.5E-5cm/cm/℃
Glass transition temperature140
Linear coefficient of thermal expansion
MD
Thermal conductivity coefficient0.70W/m/K
Post curing time
175℃0.0 to 4.0hr

Notes
1. Typical properties: these are not to be construed as specifications.
2. Melt Temperature: 347°F
3. Automold
4. Conventional mold
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