Plaskon S-7

About
This material is a state-of-the-art, low stress epoxy encapsulant designed for packaging stress-sensitive semiconductor devices. It offers end users superior value-in-use due to a balanced mix of properties.&&

Product Description
Generic环氧树脂
Material StatusCommercial: Active
FeaturesExcellent Processability,Good surface appearance,Conductive,Laser engraving,V-0
AvailabilitysNorth America

Technical Data
PHYSICALNominal valueUnitTest method
Density1.82g/cm³ASTM D792
Shrinkage rate
MD0.37%ASTM D955

MECHANICALNominal valueUnitTest method
tensile strength0.00621MPaASTM D638
Bending modulus1.24MPaASTM D790
bending strength
21℃0.0103MPaASTM D790

THERMALNominal valueUnitTest method
Glass transition temperature150ASTM E1356
Linear coefficient of thermal expansion
MD1.7E-51/℃ASTM D696
Thermal conductivity coefficient16W/m/KASTM C177

Electrical performanceNominal valueUnitTest method
Volume resistivity5.0E+15ohms·cmASTM D257
Dielectric strength16kV/mmASTM D149
Dielectric constant
1 kHz3.80 ASTM D150
Dissipation factor
1 kHz2.0E-3 ASTM D150
Arc resistance180secASTM D495

FLAME CHARACTERISTICSNominal valueUnitTest method
Flame retardant level
3.20 mmV-0 UL 94
Extreme oxygen index32%ASTM D2863

Notes
1. Typical properties: these are not to be construed as specifications.
【 Disclaimer 】
Guangzhou Soliao Information Technology Co., Ltd. reserves all rights. The information in this data table was obtained from the manufacturer of the material on soliao.com. Soliao.com makes every effort to ensure the accuracy of this data. However, the search company does not assume any responsibility for the uncertainty and consequences caused to users by these data values and suggestions, and strongly recommends verifying the data values with the material supplier before the final selection of materials.