Plaskon SMT-B-1NLV

About
This material is an epoxy molding compound optimized specifically for PBGA applications with no plasma cleaning required before molding. It has the same unique resin system as the SMT-B-1, which minimizes warpage and enables trouble-free molding onto rigid and flexible laminate substrates. Minimal dimensional change after molding, post bake and subsequent solder treatment make this compound an excellent choice for PBGA and CSP applications.&&

Product Description
Generic环氧树脂
Material StatusCommercial: Active
FeaturesLow warping,Good Dimensional Stability,Conductive,Low Viscosity,Fast Cure,V-0
AvailabilitysNorth America

Technical Data
PHYSICALNominal valueUnitTest method
Density1.88g/cm³ASTM D792

MECHANICALNominal valueUnitTest method
Bending modulus ASTM D790
22℃1.69MPaASTM D790
215℃1.01MPaASTM D790
bending strength ASTM D790
22℃0.0109MPaASTM D790
215℃0.00588MPaASTM D790

THERMALNominal valueUnitTest method
Glass transition temperature228ASTM E1356
Linear coefficient of thermal expansion
MD1.6E-51/℃ASTM D696
Thermal conductivity coefficient0.86W/m/KASTM C177

Electrical performanceNominal valueUnitTest method
Volume resistivity5.3E+16ohms·cmASTM D257
Dielectric constant
1 kHz3.70 ASTM D150
Dissipation factor
1 kHz3.5E-3 ASTM D150

FLAME CHARACTERISTICSNominal valueUnitTest method
Flame retardant level
3.20 mmV-0 UL 94
Extreme oxygen index32%ASTM D2863

Notes
1. Typical properties: these are not to be construed as specifications.
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