About |
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This material is an epoxy molding compound optimized specifically for PBGA applications with no plasma cleaning required before molding. It has the same unique resin system as the SMT-B-1, which minimizes warpage and enables trouble-free molding onto rigid and flexible laminate substrates. Minimal dimensional change after molding, post bake and subsequent solder treatment make this compound an excellent choice for PBGA and CSP applications.&& |
Product Description | |
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Generic | 环氧树脂 |
Material Status | Commercial: Active |
Features | Low warping,Good Dimensional Stability,Conductive,Low Viscosity,Fast Cure,V-0 |
Availabilitys | North America |
Technical Data | |||
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PHYSICAL | Nominal value | Unit | Test method |
Density | 1.88 | g/cm³ | ASTM D792 |
MECHANICAL | Nominal value | Unit | Test method |
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Bending modulus | ASTM D790 | ||
22℃ | 1.69 | MPa | ASTM D790 |
215℃ | 1.01 | MPa | ASTM D790 |
bending strength | ASTM D790 | ||
22℃ | 0.0109 | MPa | ASTM D790 |
215℃ | 0.00588 | MPa | ASTM D790 |
THERMAL | Nominal value | Unit | Test method |
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Glass transition temperature | 228 | ℃ | ASTM E1356 |
Linear coefficient of thermal expansion | |||
MD | 1.6E-5 | 1/℃ | ASTM D696 |
Thermal conductivity coefficient | 0.86 | W/m/K | ASTM C177 |
Electrical performance | Nominal value | Unit | Test method |
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Volume resistivity | 5.3E+16 | ohms·cm | ASTM D257 |
Dielectric constant | |||
1 kHz | 3.70 | ASTM D150 | |
Dissipation factor | |||
1 kHz | 3.5E-3 | ASTM D150 |
FLAME CHARACTERISTICS | Nominal value | Unit | Test method |
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Flame retardant level | |||
3.20 mm | V-0 | UL 94 | |
Extreme oxygen index | 32 | % | ASTM D2863 |
Notes |
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1. Typical properties: these are not to be construed as specifications. |
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