| About |
|---|
| One component liquid epoxy resin Application : Relay Advantage : Heat resistance and good adhesive strength&& |
| Product Description | |
|---|---|
| Supplier | SBHPP |
| Generic | 环氧树脂 |
| Material Status | Commercial: Active |
| Features | Good bond,Heat Resistance, Good |
| Availabilitys | Asia Pacific |
| Technical Data | |||
|---|---|---|---|
| PHYSICAL | Nominal value | Unit | Test method |
| Water absorption rate | |||
| 2HR, in water | 0.4 | % | |
| MECHANICAL | Nominal value | Unit | Test method |
|---|---|---|---|
| Bending modulus | |||
| 25℃ | 5000 | MPa | |
| bending strength | |||
| 25℃ | 83.0 | MPa |
| THERMAL | Nominal value | Unit | Test method |
|---|---|---|---|
| Glass transition temperature | 150 | ℃ | TMA |
| Linear coefficient of thermal expansion | |||
| MD | 4.0E-5 | 1/℃ | TMA |
| Supplementary information | Nominal value | Unit | Test method |
|---|---|---|---|
| Adhesive strength | |||
| Cu/Cu | 9.00 | MPa | |
| LCP/LCP | 10.0 | MPa |
| Uncured Properties | Nominal value | Unit | Test method |
|---|---|---|---|
| Density | |||
| 25℃ | 1.40 | g/cm³ | |
| viscosity | |||
| 25℃ | 20 | Pa·s | |
| Curing time | |||
| 120℃ | 0.50 | hr | |
| 100℃ | 1.0 | hr |
| Cured Properties | Nominal value | Unit | Test method |
|---|---|---|---|
| Shore hardness | |||
| Shaw’s D | 88 | ||
| Volume resistivity | |||
| 25 ℃ | 1.0E+16 | ohms·cm |
| Notes |
|---|
| 1. Typical properties: these are not to be construed as specifications. |
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